In May 2025, Pioneer Thermal is pleased to announce the development of a large-sized 3D Vapor Chamber. With a bottom plate size of up to 260 x 220 mm, designed for high-power applications exceeding 2000W and high thermal flux chips. This marks another significant breakthrough for Pioneer Thermal in addressing complex thermal management solutions.
3D Vapor Chamber (3DVC) is an advanced thermal management solution that utilizes a three-dimensional, sealed structure filled with a working fluid to efficiently dissipate heat. This technology is commonly used in high-performance electronic devices like 5G base stations and data centers, where compact and lightweight designs are needed. 

Pioneer Thermal, a leading innovator in thermal management solutions, has announced the successful development of a large-size 3D vapor chamber, marking a significant breakthrough in heat dissipation technology. This cutting-edge solution is designed to meet the growing cooling demands of high-power electronics, including data centers, 5G infrastructure, electric vehicles (EVs), and advanced gaming systems.

Key Features & Innovations of Pioneer Thermal Large-size 3D Vapor Chamber
○ Large-Size Design – The vapor chamber boasts an expanded surface area, enabling efficient heat spreading across larger components, such as CPUs, GPUs, and power electronics.
○ 3D Structural Flexibility – Unlike traditional flat vapor chambers, Pioneer’s 3D design allows for multi-directional heat transfer, improving thermal performance in compact and complex device layouts.
○ Enhanced Heat Flux Handling – Engineered to manage ultra-high heat loads, the vapor chamber ensures stable operation even under extreme conditions.
○ Lightweight & Thin Profile – Despite its large size, the design maintains a slim and lightweight structure, making it ideal for space-constrained applications.
○ Customizable Solutions – Pioneer Thermal offers tailored designs to fit specific industry needs, from AI servers to aerospace cooling systems.

Pioneer Thermal is a global leader in advanced thermal solutions, specializing in custom heat sinks, vapor chambers, heat pipes heat sink, and liquid cooling systems. The company continues to drive innovation in thermal management for next-generation technologies.